[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Electromigration failure mechanism investigation between wafer level and plackage level reliability test in AL interconects
Dulin, Wang, Nee, Ong Cheng, Seng, Ng HongYear:
2016
Language:
english
DOI:
10.1109/cstic.2016.7464082
File:
PDF, 422 KB
english, 2016