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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - High-lead die attach printing paste for power package assembly
Ruifen, Zhang, Mesa, Baquiran Joseph Aaron, Wei, Teo KengYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412384
File:
PDF, 1.13 MB
english, 2015