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[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Intrinsic stress effects on the warpage of silicon substrate during thin film deposition, photolithography and etching processes
Yao, WeiZhen, Belhenini, Soufyane, Roqueta, Fabrice, Pujos, Cyril, Bruno, Erwan, Gardes, Pascal, Tougui, AbdellahYear:
2016
Language:
english
DOI:
10.1109/eurosime.2016.7463306
File:
PDF, 581 KB
english, 2016