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High-Removal Selectivity Through Interaction Between Polyacrylamide and SiO2 Film in Poly Isolation Chemical Mechanical Planarization
Kim, Ye-Hwan, Lee, Kee-June, Park, Jea-Gun, Paik, UngyuVolume:
9
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2009.ns67
Date:
June, 2009
File:
PDF, 1.37 MB
english, 2009