Study on Characteristic of Material Removal Rate in...

Study on Characteristic of Material Removal Rate in Chemical Mechanical Polishing of Silicon Wafer

Su, Jianxiu, Chen, Xiqu, Zhang, Xueliang, Du, Jiaxi, Guo, Dongming
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Volume:
5
Language:
english
Journal:
Journal of Computational and Theoretical Nanoscience
DOI:
10.1166/jctn.2008.844
Date:
August, 2008
File:
PDF, 650 KB
english, 2008
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