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Study on Characteristic of Material Removal Rate in Chemical Mechanical Polishing of Silicon Wafer
Su, Jianxiu, Chen, Xiqu, Zhang, Xueliang, Du, Jiaxi, Guo, DongmingVolume:
5
Language:
english
Journal:
Journal of Computational and Theoretical Nanoscience
DOI:
10.1166/jctn.2008.844
Date:
August, 2008
File:
PDF, 650 KB
english, 2008