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[IEEE 2015 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2015.12.7-2015.12.9)] 2015 IEEE International Electron Devices Meeting (IEDM) - Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
Nogami, Takeshi, Briggs, Benjamin D, Korkmaz, Sevim, Chae, Moosung, Penny, Christopher, Li, Juntao, Wang, Wei, McLaughlin, Paul S, Kane, Terence, Parks, Christopher, Madan, Anita, Cohen, Stephan, ShawYear:
2015
Language:
english
DOI:
10.1109/IEDM.2015.7409651
File:
PDF, 1.57 MB
english, 2015