[IEEE 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2016.1.25-2016.1.28)] 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer
Cho, Kyungjun, Lee, Hyunsuk, Kim, JounghoYear:
2016
Language:
english
DOI:
10.1109/PanPacific.2016.7428425
File:
PDF, 1.69 MB
english, 2016