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Saddle-shape warpage of thick 3C-SiC wafer: Effect of nonuniform intrinsic stress and stacking faults
Yu Sun, Satoshi Izumi, Shinsuke Sakai, Kuniaki Yagi, Hiroyuki NagasawaVolume:
249
Year:
2012
Language:
english
Pages:
5
DOI:
10.1002/pssb.201147341
File:
PDF, 343 KB
english, 2012