[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system
Kikuchi, Katsuya, Ueda, Chihiro, Fujii, Fumiaki, Akiyama, Yutaka, Watanabe, Naoya, Kitamura, Yasuhiro, Gomyo, Toshio, Ookubo, Toshikazu, Koyama, Tetsuya, Kamada, Tadashi, Aoyagi, Masahiro, Otsuka, KanYear:
2012
Language:
english
DOI:
10.1109/3dic.2012.6263017
File:
PDF, 284 KB
english, 2012