[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability analysis of Cu wire bonds in microelectronic packages
Mazloum-Nejadari, A., Khatibi, G., Czerny, B., Lederer, M., Nicolics, J., Weiss, L.Year:
2016
Language:
english
DOI:
10.1109/eurosime.2016.7463363
File:
PDF, 933 KB
english, 2016