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[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Soft CMP pads for low defectivity in CMP processes

Fengji Yeh,, Yeh, Anson, DeGroot, Marty W., Qian, Bainian, Reddy, Arun, Buley, Todd
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Year:
2014
Language:
english
DOI:
10.1109/icpt.2014.7017273
File:
PDF, 598 KB
english, 2014
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