SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Monday 18 September 2000)] Challenges in Process Integration and Device Technology - Etching characteristics of organic low-k dielectrics in the helicon-wave plasma etcher for 0.15-μm damascene architecture
Shieh, Jia-Min, Wei, T. C., Liu, C. H., Suen, Shich-Chang, Dai, Bau-Tong, Burnett, David, Kimura, Shin'ichiro, Singh, BhanwarVolume:
4181
Year:
2000
Language:
english
DOI:
10.1117/12.395724
File:
PDF, 505 KB
english, 2000