SPIE Proceedings [SPIE Asia Pacific Optical Communications - Hangzhou, China (Sunday 26 October 2008)] Passive Components and Fiber-based Devices V - Thermal stress effects of the interlayer between waveguide cores in buried channel optical waveguides
Huang, Huamao, Li, Ming-Jun, Shum, Ping, Huang, Dexiu, Liu, Wen, White, Ian H., Wu, Xingkun, Cheng, ZuhaiVolume:
7134
Year:
2008
Language:
english
DOI:
10.1117/12.802506
File:
PDF, 468 KB
english, 2008