[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - 200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS
Rebhan, B., Bernauer, M., Wagenleitner, T., Heilig, M., Kurz, F., Lhostis, S., Deloffre, E., Jouve, A., Balan, V., Chitu, L.Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412403
File:
PDF, 606 KB
english, 2015