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SPIE Proceedings [SPIE Microelectronic Manufacturing Technologies - Edinburgh, United Kingdom (Wednesday 19 May 1999)] In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing - Use and function of TXRF (total reflection x-ray fluorescence) for routine in fab metallic monitoring
Allen, Mike, Hossain, Tim Z., Lebowitz, Joseph, Amberiadis, Kostas, Kissinger, Gudrun, Okumura, Katsuya, Pabbisetty, Seshu, Weiland, Larg H.Volume:
3743
Year:
1999
Language:
english
DOI:
10.1117/12.346909
File:
PDF, 162 KB
english, 1999