[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure
Oizono, Yoshiaki, Nabeshima, Yoshitaka, Okumura, Takafumi, Sudo, Toshio, Sakai, Atsushi, Uchiyama, Shiro, Ikeda, HiroakiYear:
2012
Language:
english
DOI:
10.1109/3dic.2012.6263028
File:
PDF, 161 KB
english, 2012