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[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Drop Impact Life Prediction Model for Wafer Level Chip Scale Packages
Kim Yong Goh,, Jing-en Luan,, Tong Yan Tee,Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614368
File:
PDF, 4.41 MB
english, 2005