[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Thermal cycling reliability analysis of an anisotropic conductive adhesive attached large-area chip with area array configuration
Kiilunen, Janne, Lahokallio, Sanna, Frisk, LauraYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412380
File:
PDF, 1.09 MB
english, 2015