SPIE Proceedings [SPIE Asia Pacific Symposium on Microelectronics and MEMS - Gold Coast, Australia (Wednesday 27 October 1999)] Electronics and Structures for MEMS - Flip-chip process development using recessed bonding pads for laser/MEMS integration
Rosa, Michel A., Sun, Decai, Bergmann, Neil W., Reinhold, Olaf, Tien, Norman C.Volume:
3891
Année:
1999
Langue:
english
DOI:
10.1117/12.364472
Fichier:
PDF, 2.52 MB
english, 1999