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SPIE Proceedings [SPIE Design, Test, Integration, and Packaging of MEMS/MOEMS 2001 - Cannes-Mandelieu, France (Wednesday 25 April 2001)] Design, Test, Integration, and Packaging of MEMS/MOEMS 2001 - Compact dynamic thermal multiport models of packages for MEMS-package cosimulation
Rencz, Marta, Szekely, Vladimir, Courtois, Bernard, Karam, Jean Michel, Levitan, Steven P., Markus, Karen W., Tay, Andrew A. O., Walker, James A.Volume:
4408
Year:
2001
Language:
english
DOI:
10.1117/12.425360
File:
PDF, 565 KB
english, 2001