Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder...

Materials Science and Engineering: A 2016 / 07 Vol. 669

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri, Ani, Fakhrozi Che, Samsudin, Zambri, Sahin, Salim, Abdullah, Mohd Zulkifly, Mohamad, Ahmad Azmin
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Volume:
669
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2016.05.081
Date:
July, 2016
File:
PDF, 4.99 MB
english, 2016
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