[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device
Chen, Wei-Chung, Lee, Chiu-Wen, Lin, Lu-Fu, Liu, Yen-Fu, Cheng, Hau, Hsu, Te-Jung, Tsai, Kun-Ting, Chen, Ming-Hung, Chen, Tang-Yuan, Yang, Pin-Feng, Uegaki, Shoji, Hung, Chih-PinYear:
2016
Language:
english
DOI:
10.1109/ICEP.2016.7486883
File:
PDF, 1.01 MB
english, 2016