[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Detection of flip chip solder joint cracks using correlation coefficient analysis of laser ultrasound signals
Lizheng Zhang,, Ume, I.C., Gamalski, J., Galuschki, K.-P.Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319323
File:
PDF, 1.10 MB
english, 2004