[IEEE 2014 15th International Conference on Electronic...

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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - The thermal treatment effect on electrical properties of mn-modified polycrystalline BiFeO3 thin films

Kim, Sangwook, Kim, Won-Jeong, Lee, Myang Hwan, Park, Jin Su, Kim, Da Jeong, Kim, Myong-Ho, Song, Tae Kwon, Do, Dalhyun
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Year:
2014
Language:
english
DOI:
10.1109/icept.2014.6918737
File:
PDF, 389 KB
english, 2014
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