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SPIE Proceedings [SPIE Microelectronic Manufacturing Technologies - Edinburgh, United Kingdom (Wednesday 19 May 1999)] In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing - Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect
Kim, YongTae, Kim, Dong J., Lee, Seoghyeong, Park, Young K., Kim, Ik-Soo, Park, Jong-Wan, Amberiadis, Kostas, Kissinger, Gudrun, Okumura, Katsuya, Pabbisetty, Seshu, Weiland, Larg H.Volume:
3743
Year:
1999
Language:
english
DOI:
10.1117/12.346918
File:
PDF, 342 KB
english, 1999