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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Francisco, CA (Monday 22 October 2001)] Micromachining and Microfabrication Process Technology VII - Integrated cavity wafer level chip size package for MEMS applications
Weiss, Danny, Teomim, Doron, Badihi, Avner P., Zilber, Gil, Karam, Jean Michel, Yasaitis, John A.Volume:
4557
Year:
2001
Language:
english
DOI:
10.1117/12.442942
File:
PDF, 260 KB
english, 2001