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SPIE Proceedings [SPIE AeroSense 2003 - Orlando, FL (Monday 21 April 2003)] Thermosense XXV - Thermal profiling for IC chip high-voltage stress prediction
Hsieh, Sheng-Jen, Huang, Sung-Ling, Cramer, K. Elliott, Maldague, Xavier P.Volume:
5073
Year:
2003
Language:
english
DOI:
10.1117/12.486872
File:
PDF, 256 KB
english, 2003