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Nanoneedles based on porous silicon for chip bonding with self assembly capability
Prasad Jonnalagadda, Ulrich Mescheder, Andras Kovacs, Antwi NimoeVolume:
8
Year:
2011
Language:
english
Pages:
6
DOI:
10.1002/pssc.201000139
File:
PDF, 458 KB
english, 2011