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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Higher thermal cycling reliability of power semiconductor module for power converters
Morozumi, Akira, Hokazono, H., Nishimura, Yoshitaka, Kariya, Yoshiharu, Mochizuki, Eiji, Takahashi, YoshikazuYear:
2016
Language:
english
DOI:
10.1109/ICEP.2016.7486857
File:
PDF, 1.16 MB
english, 2016