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[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Development of thin 3D WLCSP using vertical via last TSV technology
Yu, Daquan, Xiao, Zhiyi, Fan, Jun, Ren, Yulong, Huo, JinqianYear:
2016
Language:
english
DOI:
10.1109/cstic.2016.7464056
File:
PDF, 740 KB
english, 2016