[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Thermoelastic damping modeling of a Si resonant beam with nanowire strain gauges
Lehee, Guillaume, Parrain, Fabien, Riou, Jean-Christophe, Bosseboeuf, AlainYear:
2014
Language:
english
DOI:
10.1109/dtip.2014.7056653
File:
PDF, 1007 KB
english, 2014