[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Board level reliability study on three-dimensional thin stacked package
Jin-Young Kim,, Won-Joon Kang,, Yoon-Hyun Ka,, Yong-Joon Kim,, Eun-Sook Sohn,, Sung-Su Park,, Jae-Dong Kim,, Choon-Heung Lee,, Yoshida, A., Syed, A.Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319403
File:
PDF, 649 KB
english, 2004