[IEEE 2005 7th Electronic Packaging Technology Conference -...

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Investigating the Cyclic Bending of PCB Subassembly During Board Level Drop Test

Pek, E., Chwee Teck Lim,, Tong Yan Tee,, Jing-en Luan,, Tan, V.B.C.

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Volume:

Year:

2005

Language:

english

DOI:

10.1109/eptc.2005.1614406

File:

PDF, 4.93 MB

english, 2005

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