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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Power QFN down bond lift and delamination study

Zhang, Hanmin, Hu, M., Wang, Sonder, Ilko, Schmadlak, Yin, B. G, He, Q. C, Ye, D. H
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Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028424
File:
PDF, 625 KB
english, 2014
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