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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Wafer level CSP with ultra-high thermal reliability lead-free alloys
Ribas, Morgana, Lim, Garian, Bumagat, Rommel T., Kumar, Anil, Kosuri, Divya, Augustine, Prathap, Choudhury, Pritha, Rangaraju, Raghu R., Telu, Suresh, Sarkar, Siuli, Sobczak, Martin, Singh, BawaYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412266
File:
PDF, 1.23 MB
english, 2015