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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology
Che, F.X., Ho, David, Ding, Mian Zhi, Zhang, XiaowuYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412319
File:
PDF, 1010 KB
english, 2015