[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Modeling and simulation of the ultrasonic wire bonding process
Meyer, Tobias, Unger, Andreas, Althoff, Simon, Sextro, Walter, Brokelmann, Michael, Hunstig, Matthias, Guth, KarstenYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412377
File:
PDF, 265 KB
english, 2015