[IEEE 2015 IEEE 17th Electronics Packaging and Technology...

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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - 3D integration technology using W2W direct bonding and TSV for CMOS based image sensors

Pham, Nga. P., Tutunjyan, Nina, Volkaerts, Danny, Peng, Lan, Jamison, Geraldine, Tezcan, Deniz Sabuncuoglu
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Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412378
File:
PDF, 2.78 MB
english, 2015
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