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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Insulated Au-Flash PdCu wire processing and wire bond process robustness improvements for TBGA & LQFP packages
Teck, Siong Chin, Leng, Eu Poh, Chu, Tan Lan, Ibrahim, Mohd Rusli, Xi, Zhang, Yee, Loh Wan, Dan, Su, Wei, Tok CheeYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412412
File:
PDF, 1.60 MB
english, 2015