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[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - CFD analysis of wave soldering interpin behaviour
Yuile, Adam, Wiese, SteffenYear:
2016
Language:
english
DOI:
10.1109/eurosime.2016.7463356
File:
PDF, 522 KB
english, 2016