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[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process
Hu, Liulin, Jin, Zhu, Liao, Xuejie, Ouyang, Yaoguo, Dong, JinshengYear:
2014
Language:
english
DOI:
10.1109/isaf.2014.6917824
File:
PDF, 904 KB
english, 2014