[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - A new designed trench structure to reduce the wafer warpage in wafer level packaging process
Zhu, Chunsheng, Lee, Heng, Ye, Jiaotuo, Xu, Gaowei, Luo, Le, Zhu, Chunsheng, Lee, Heng, Ye, JiaotuoYear:
2014
Language:
english
DOI:
10.1109/isaf.2014.6917938
File:
PDF, 850 KB
english, 2014