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[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding
Xu, Gaowei, Zhu, Chunsheng, Ye, Jiaotuo, Li, Heng, Gai, Wei, Luo, LeYear:
2014
Language:
english
DOI:
10.1109/isaf.2014.6918041
File:
PDF, 441 KB
english, 2014