[IEEE 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Chicago, IL, USA (2015.5.3-2015.5.6)] 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Thermal interface material evaluation for IGBT modules under realistic power cycling conditions
Morris, Garron K., Polakowski, Matthew, Wei, Lixiang, Ball, Martin D., Phillips, Mark G., Mosey, Craig, Lukaszewski, Richard A.Year:
2015
Language:
english
DOI:
10.1109/iwipp.2015.7295991
File:
PDF, 1.49 MB
english, 2015