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[IEEE 2006 International Workshop on Junction Technology - Shanghai, China (15-16 May 2006)] 2006 International Workshop on Junction Technology - ECV Profiling of Ultra-Shallow Junction Formed by Plasma Doping
Hui-Zhen Wu,, Ru, G., Jin, C.G., Mizuno, B., Yu-Long Jiang,, Xin-Ping Qu,, Bing-Zong Li,Year:
2006
Language:
english
DOI:
10.1109/iwjt.2006.1669462
File:
PDF, 2.61 MB
english, 2006