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Chip-Level Packaging of Edge-Emitting Laser Diodes Onto Low-Cost Transparent Polymer Substrates Using Optodic Bonding
Wang, Yixiao, Overmeyer, LudgerVolume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2543028
Date:
May, 2016
File:
PDF, 1.42 MB
english, 2016