SPIE Proceedings [SPIE OE/LASE '94 - Los Angeles, CA (Sunday 23 January 1994)] Optoelectronic Interconnects II - Self-alignment by flip-chip bonding for OE-MCM packaging
Patra, Susant K., Ma, Jian, Ozguz, Volkan H., Lee, Sing H., Chen, Ray T., Neff, John A.Volume:
2153
Year:
1994
Language:
english
DOI:
10.1117/12.174501
File:
PDF, 608 KB
english, 1994