SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Manufacturability, Yield, and Reliability - Temperature-cycle-induced chip surface damage in lead-on-chip packages
Amagai, Masazumi, Vasquez, Barbara, Kawasaki, HisaoVolume:
2334
Year:
1994
Language:
english
DOI:
10.1117/12.186765
File:
PDF, 493 KB
english, 1994