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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections
Nakahira, Kota, Endo, Fumiaki, Furuya, Ryosuke, Suzuki, Ken, Miura, HideoYear:
2012
Language:
english
DOI:
10.1109/3dic.2012.6262997
File:
PDF, 517 KB
english, 2012