[IEEE 2015 IEEE 17th Electronics Packaging and Technology...

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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis

Chen, Zhaohui, Hwang, How Yuan, Jaafar, Norhanani, Rhee, Daniel Min Woo
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Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412307
File:
PDF, 872 KB
english, 2015
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